I am aware of the self diagnostics mode but i have not found any issues. I believe it is the dry contacts on the back of the board. Apparently Frauds used lead free solder which is porous and leads to moisture pockets cracking the solder.

This would also explain why the problem i have is intermittent. This weekend i plan on getting out the soldering iron and touching the existing solder to re-solidify them, hopefully without blowing any of the IC controllers or resistors etc.

I'll let everyone know how i get on and do a "How To" if it all works out.

cheeRS